abstract
- © 2018 IEEE. Nanotechnology entails the application of fields of science as diverse as surface science, micro- and nano-fabrication, material science, etc. This paper shows the application of this new technology to explore electrical contact joining methods that are traditionally welded by filler material knowing as Sil-Fos. This work presents how silver nanoparticle were synthesized and used to replace the traditional methods for joining electrical contacts with copper line terminals. Moreover the joint obtained shown good mechanical strength, thermal and electrical conductivity. To validate the joint interface a characterization of the microstructure was analyzed by SEM and the strength and quality of the joint was analyzed by mechanical testing techniques and the electrical resistance of the assembly was measure. This work opens the doors for the use of materials in nano size that can be used to perform mechanical joint of electrical components.