Impact of genipin and temperature on the physicochemical and structural properties of nopal mucilage, water-soluble chitosan, and locust bean gum Academic Article in Scopus uri icon

abstract

  • Nopal mucilage, water-soluble (WS) chitosan, and locust bean gum are versatile biopolymers that can enhance their functionality by cross-linking for innovative food applications. In this study, these polysaccharides were cross-linked with genipin to evaluate their temperature-dependent colloidal stability (particle size, polydispersity index PDI, zeta potential and conductivity), morphology, structure, topography, and chemical composition. Cross-linked nopal mucilage exhibited the largest particle size (4.2 ¿m), followed by locust bean gum (2 ¿m), and WS chitosan (0.5 ¿m). Both cross-linked nopal mucilage and locust bean gum displayed the lowest PDI (0.4). Zeta potential values ranged from ¿ 10 to ¿ 22 mV for nopal mucilage, 0 to 40 mV for WS chitosan, and ¿ 8 to 42 mV for locust bean gum. All polysaccharides demonstrated increased conductivity after cross-linking, evidencing electrochemical and structural changes. Scanning Electron Microscopy confirmed the particle size and cross-linking effects. Among the non-cross-linked polysaccharides, locust bean gum exhibited the highest roughness (15.63 nm). Cross-linked nopal mucilage showed increased peak heights and roughness compared to its non-cross-linked form. The topography of WS chitosan changed from a granular surface to elevations and depressions. Peak heights and roughness of cross-linked locust bean gum decreased after cross-linking, resulting in a smoother surface. Absorption bands at ~ 1558 cm¿¹ and ~ 1634¿1653 cm¿¹ confirmed the cross-linking reaction between genipin esters and the hydroxyl and amino groups. These cross-linked polysaccharides are promising candidates for food systems by improving the delivery of bioactive compounds, enhancing structural stability, and increasing conductivity, thereby supporting controlled release and smart packaging sensor technologies.

publication date

  • February 1, 2026