Industry Collaboration and Comprehensive Mentorship for Future-Oriented Competency Development
Academic Article in Scopus
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In today's rapidly evolving job market, academic institutions implement diverse strategies to enhance students' professional competencies and employability. These strategies include active industry and educational partner involvement in curriculum development, the promotion of soft skills, the integration of real-world experiences, and the implementation of internship programs. At Tecnológico de Monterrey, the Tec21 educational model is structured around four core pillars: challenge-based learning, academic flexibility, inspiring faculty, and comprehensive student support. This study examines the impact of industry collaboration and mentorship on student development in two specific programs: Mechatronics Engineering and Industrial Engineering. Throughout their academic journey, students engage with over ten companies, applying theoretical knowledge to solve real-world challenges. These experiences not only strengthen technical competencies but also foster essential soft skills such as teamwork, problem-solving, adaptability, and leadership. Industry collaboration is a fundamental component of Tec21, ensuring students are consistently exposed to industry-driven challenges and gaining hands-on experience through internships and project-based learning. This research explores the impact of two key componentsindustry collaboration and comprehensive mentorship-on the development of future-oriented competencies. The study assesses their contribution to the holistic growth of three cohorts (620 students), preparing them to tackle both current and emerging engineering challenges. The findings indicate that students engaged in industry projects demonstrate greater readiness to address complex, real-world problems, exhibiting enhanced adaptability and problem-solving skills. Furthermore, the mentorship model significantly improves student engagement and motivation, fostering increased confidence and competence in both academic and professional settings. © 2025 IEEE.
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